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  ? semiconductor components industries, llc, 2005 june, 2005 ? rev. 1 1 publication order number: df6a6.8fut1/d df6a6.8fut1 quad array for esd protection this quad voltage suppressor is designed for applications requiring transient overvoltage protection capability. it is intended for use in voltage and esd sensitive equipment such as computers, printers, business machines, communication systems, medical equipment, and other applications. its quad junction common anode design protects four separate lines using only one package. these devices are ideal for situations where board space is at a premium. specification features ? sc?88 package allows four separate unidirectional configurations ? low leakage < 1  a @ 5 volt ? breakdown voltage: 6.4 ? 7.2 volt @ 5 ma ? low capacitance (40 pf typical) ? esd protection meeting 61000?4?2 level 4 and 16 kv human body model ? pb?free package is available mechanical characteristics ? void free, transfer?molded, thermosetting plastic case ? corrosion resistant finish, easily solderable ? package designed for optimal automated board assembly ? small package size for high density applications maximum ratings (t a = 25 c unless otherwise noted) rating symbol value unit peak power dissipation @ 8 x 20  s (note 1) p pk 75 watts steady state power dissipation (note 2) p d 385 mw thermal resistance ? junction?to?ambient derate above 25 c r  ja 328 3.0 c/w mw/ c maximum junction temperature t jmax 150 c operating junction and storage temperature range t j , t stg ?55 to +150 c esd discharge mil std 883c ? method 3015?6 iec61000?4?2, air discharge iec61000?4?2, contact discharge v pp 16 16 8 kv lead solder temperature (10 seconds duration) t l 260 c maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. per waveform figure 1 2. mounted on fr?5 board = 1.0 x 0.75 x 0.062 in. sc?88 case 419b?02 http://onsemi.com 6 4 1 3 device package shipping ? ordering information df6a6.8fut1 sc?88 (pb?free) 3000/tape & ree l marking diagram 5 2 df6a6.8fut1g 3000/tape & ree l sc?88 ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. 68 m 68 = specific device code m = date code = pb?free package 1 6 (note: microdot may be in either location.)
df6a6.8fut1 http://onsemi.com 2 v?i curve i f v i i r i t v rwm v br v f electrical characteristics device device marking breakdown voltage v br @ 5 ma (volts) leakage current i rm @ v rwm = 5 v typical capacitance @ 0 v bias max v f @ i f = 10 ma max z z @ 5 ma max z zk @ 0.5 ma min nom max (  a) (pf) (v) (  ) (  ) df6a6.8fut1 68 6.4 6.8 7.2 1.0 40 1.25 30 300 figure 1. 8 20  s pulse waveform 100 90 80 70 60 50 40 30 20 10 0 020406080 t, time (  s) % of peak pulse current t p t r pulse width (t p ) is defined as that point where the peak current decay = 8  s peak value i rsm @ 8  s half value i rsm /2 @ 20  s figure 2. capacitance 45 40 35 30 50 25 15 20 10 01 3 5 bias voltage (volts) typical capacitance (pf) 4 2 1 mhz frequency figure 3. forward voltage figure 4. clamping voltage versus peak pulse current 0.6 0.7 0.8 0.9 v f , forward voltage (volts) 10 1 8 9 10 12 v c , clamping voltage (volts) i , peak pulse current (amps) pp 1.0 1.1 1.2 i , forward current (a) f 11 8 x 20  s per figure 1 0.0001 0.01 0.1 1 0.001
df6a6.8fut1 http://onsemi.com 3 package dimensions sc?88/sc70?6/sot?363 case 419b?02 issue v notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 419b?01 obsolete, new standard 419b?02. e 0.2 (0.008) mm 123 d e a1 a a3 c l 654 ?e? b 6 pl dim min nom max millimeters a 0.80 0.95 1.10 a1 0.00 0.05 0.10 a3 b 0.10 0.21 0.30 c 0.10 0.14 0.25 d 1.80 2.00 2.20 0.031 0.037 0.043 0.000 0.002 0.004 0.004 0.008 0.012 0.004 0.005 0.010 0.070 0.078 0.086 min nom max inches 0.20 ref 0.008 ref h e h e e 1.15 1.25 1.35 e 0.65 bsc l 0.10 0.20 0.30 2.00 2.10 2.20 0.045 0.049 0.053 0.026 bsc 0.004 0.008 0.012 0.078 0.082 0.086  mm inches  scale 20:1 0.65 0.025 0.65 0.025 0.50 0.0197 0.40 0.0157 1.9 0.0748 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* sc?88/sc70?6/sot?363
df6a6.8fut1 http://onsemi.com 4 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, r epresentation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2?9?1 kamimeguro, meguro?ku, tokyo, japan 153?0051 phone : 81?3?5773?3850 df6a6.8fut1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082?1312 usa phone : 480?829?7710 or 800?344?3860 toll free usa/canada fax : 480?829?7709 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.


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